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物理气相沉积 (PVD)

PVD 是物理气相沉积的缩写,PVD是在真空状态下材料蒸发沉积的技术,真空腔室是必备的条件,以避免蒸发出的材料和空气反应,PVD涂层用来制备新的、具有额外价值和特点的产品,如绚丽的色彩、耐磨损能力和降低摩擦。利用物理气相沉积 (PVD) 工艺,通过冷凝大部分金属材料并与气体结合,如氮,形成涂层。 基体材料是从固态转化为气态,并如在电弧工艺中一样被接受到的热能电离,或者如在溅射工艺中一样由动能电离。PVD技术是环保无污染的,致诚真空科技专注开发于PVD镀膜。

“物理气相沉积”(PVD)涵盖了薄膜技术领域的特殊工艺。它指代一切在真空基础下运用物理方式在基片表面沉积薄膜的镀膜工艺。

溅射工艺作为最为经济的沉积方法,在众多工艺中被视作标准镀膜技术,广泛应用于多种工业领域。溅射工艺如此流行的主要原因之一,是可以在种类繁多的基材上沉积多种材料。

溅射工艺广泛应用于多种领域,例如,半导体工业表面处理、光学工业偏振滤镜的生产或建筑玻璃工业大面积表面镀膜等。

我们不仅向客户提供镀膜设备,而且自行研发生产溅射靶材。我们的专业经验在超过15年的实践经验中不断得以完善。


所有PVD工艺中,用于生长薄膜的材料最初均为固体形式,且常被置于工艺腔室内的某处,比如,溅射靶材中。为使材料气化且随后能以薄膜的形式聚合沉积到基材表面,工艺过程中将应用到多种方式 (例如,使用短时、高能量的射频脉冲、加电弧、通过离子或电子轰击等)。

在热蒸发沉积工艺中,用于生长薄膜的材料将被电加热器加热,直至其转化为气态。PVD方法谱系也包括分子束外延和离子束溅射镀膜。上述方法产出的薄膜纯度超高、均匀性极好,而且对基材的附着力极强。PVD镀膜比传统电化学工艺更为环保,可利用其作为替代传统电化学工艺广泛应用于多种领域。

Physical vapor deposition (PVD)

PVD is the abbreviation of physical vapor deposition. PVD is the technology of material evaporation deposition in vacuum. Vacuum chamber is the necessary condition to avoid the reaction between the evaporated material and air. PVD coating is used to prepare new products with additional value and characteristics, such as gorgeous color, wear resistance and reducing friction. Using the physical vapor deposition (PVD) process, a coating is formed by condensing most of the metal materials and combining them with gases such as nitrogen. The matrix material is transformed from solid state to gaseous state and is ionized by heat energy as in arc process, or by kinetic energy as in sputtering process. PVD technology is environmentally friendly and pollution-free. Zhicheng vacuum technology focuses on PVD coating.

Physical vapor deposition (PVD) covers special processes in the field of thin film technology. It refers to all the coating process of depositing thin films on the substrate surface by physical means under vacuum.

As the most economical deposition method, sputtering technology is widely used in many industrial fields as a standard coating technology. One of the main reasons why sputtering technology is so popular is that a variety of materials can be deposited on a wide variety of substrates.

Sputtering technology is widely used in many fields, such as semiconductor industry surface treatment, optical industry polarization filter production or building glass industry large area surface coating.

We not only provide coating equipment to customers, but also develop and produce sputtering target materials by ourselves. Our professional experience has been continuously improved in more than 15 years of practical experience.


In all PVD processes, the materials used to grow thin films are initially solid and are often placed somewhere in the process chamber, such as sputtering target. In order to vaporize the material and then polymerize and deposit it on the surface of the substrate in the form of thin film, the process will be applied in a variety of ways (for example, using short-time, high-energy RF pulse, adding arc, ion or electron bombardment, etc.).

In the thermal evaporation deposition process, the material used for film growth is heated by an electric heater until it is converted into a gaseous state. The spectrum of PVD method also includes molecular beam epitaxy and ion beam sputtering. The film produced by the above method has ultra-high purity, excellent uniformity and strong adhesion to the substrate. PVD coating is more environmentally friendly than traditional electrochemical process, which can be widely used in many fields as an alternative to traditional electrochemical process.


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