致诚科技,是一家专业研发生产各种真空设备应用的创新企业!
  • 咨询热线:137-1337-5955(邓工)
PVD技术磁控溅射技术电子束蒸发DLCHIPIMSPACVDCVD

溅射是物理气相沉积技术的另一种方式。
什么是溅射技术?

溅射是物理气相沉积技术的另一种方式,溅射的过程是由离子轰击靶材表面,使靶材材料被轰击出来的技术。惰性气体,如氩气,被充入真空腔内,通过使用高电压,产生辉光放电,加速离子到靶材表面,氩离子将靶材材料从表面轰击(溅射)出来,在靶材前的工件上沉积下来,通常还需要用到其它气体,如氮气和乙炔,和被溅射出来的靶材材料发生反应,形成化合物薄膜。溅射技术可以制备多种涂层,在装饰涂层上具有很多优点(如Ti、Cr、Zr和碳氮化物),因为其制备的涂层非常光滑,这个优点使溅射技术也广泛应用于汽车市场的摩擦学领域(例如,CrN、Cr2N及多种类金刚石(DLC)涂层)。高能量离子轰击靶材,提取原子并将它们转化为气态,利用磁控溅射技术,可以对大量材料进行溅射。


Sputtering is another way of physical vapor deposition.

What is sputtering technology?

Sputtering is another way of physical vapor deposition technology. The process of sputtering is to bombard the surface of the target material by ions. Inert gas, such as argon, is charged into the vacuum chamber. By using high voltage, glow discharge is generated to accelerate the ions to the target surface. Argon ions bombard (sputter) the target material from the surface and deposit it on the workpiece in front of the target. Other gases, such as nitrogen and acetylene, are usually used to react with the sputtered target material, Compound films are formed. Sputtering technology can prepare a variety of coatings, and has many advantages in decorative coatings (such as Ti, Cr, Zr and carbonitride). Because the coatings prepared by sputtering technology are very smooth, this advantage makes sputtering technology also widely used in the automotive market in the field of Tribology (such as CrN, Cr2N and various kinds of diamond (DLC) coatings). High energy ions bombard the target, extract the atoms and transform them into gas. Magnetron sputtering technology can be used to sputter a large number of materials.

溅射技术的优点:
+ 靶材采用水冷,减少热辐射
+ 不需要分解的情况下,几乎任何金属材料都可以作为靶材溅射
+ 绝缘材料也可以通过使用射频或中频电源溅射
+ 制备氧化物成为可能(反应溅射)
+ 良好的涂层均匀性
+ 涂层非常光滑(没有液滴)
+ 阴极(最大2m长)可以放置在任何位置,提高了设备设计的灵活性

Advantages of sputtering technology:

+The target is water-cooled to reduce thermal radiation

+Almost any metal material can be sputtered as a target without decomposition

+The insulating material can also be sputtered by using RF or intermediate frequency power supply

+Preparation of oxide possible (reactive sputtering)

+Good coating uniformity

+Very smooth coating (no droplets)

+The cathode (up to 2m long) can be placed in any position, which improves the flexibility of equipment design


溅射技术的缺点:
- 与电弧技术比较,较低的沉积速率
- 与电弧相比,等离子体密度较低(~5%),涂层结合力和涂层致密度较低

The disadvantages of sputtering technology are as follows

-Compared with arc technology, the deposition rate is lower

-Compared with the arc, the plasma density is lower (~ 5%), and the adhesion and density of the coating are lower


溅射技术有多种形式,这里我们将解释其中的一些,这些溅射技术都能在致诚真空科技生产的真空镀膜设备上实现。
+ 磁控溅射 使用磁场保持靶材前面等离子体,强化离子的轰击,提高等离子体密度。
+ UBM 溅射是非平衡磁控溅射的缩写。使用增强的磁场线圈加强工件附近的等离子密度。可以得到更加致密的涂层。在UBM过程中使用了更高的能量,所以温度也会相应升高。
+ 闭合场溅射 运用磁场分布限制等离子体于闭合场内。降低靶材材料对真空腔室的损失并使等离子体更加靠近工件。可以得到致密涂层,并且使真空腔室保持相对清洁。
+ 孪生靶溅射(DMS)是用来沉积绝缘体涂层的技术。交流电(AC)作用在两个阴极上,而不是在阴极和真空腔室之间采用直流(DC)。这样使靶材具有自我清理功能。孪生靶磁控溅射用来高速沉积如氧化物涂层。
+ HIPIMS+ (高功率脉冲磁控溅射)采用高脉冲电源提高溅射材料的离化率。运用HIPIMS+ 制备的涂层兼具了电弧技术和溅射技术的优点。HIPIMS+ 形成致密涂层,具有良好涂层结合力,同时也是原子级的光滑和无缺陷的涂层。

There are many forms of sputtering technology. Here we will explain some of them. These sputtering technologies can be realized on the vacuum coating equipment produced by Zhicheng vacuum technology.

+Magnetron sputtering uses magnetic field to keep plasma in front of target, strengthen ion bombardment and improve plasma density.

+UBM sputtering is the abbreviation of unbalanced magnetron sputtering. An enhanced magnetic field coil is used to enhance the plasma density near the workpiece. A more compact coating can be obtained. Higher energy is used in the UBM process, so the temperature will rise accordingly.

+Closed field sputtering uses the distribution of magnetic field to confine the plasma in the closed field. It can reduce the loss of the target material to the vacuum chamber and make the plasma closer to the workpiece. A dense coating can be obtained and the vacuum chamber can be kept relatively clean.

+Twin target sputtering (DMS) is a technique for depositing insulator coatings. Alternating current (AC) acts on two cathodes instead of direct current (DC) between the cathode and the vacuum chamber. In this way, the target has the function of self-cleaning. Twin target magnetron sputtering is used for high-speed deposition of oxide coatings.

+Hipims + (high power pulsed magnetron sputtering) uses high pulse power supply to improve the ionization rate of sputtered materials. The coating prepared by hipims + has the advantages of both arc technology and sputtering technology. Hipims + forms a dense coating with good adhesion, and is also an atomic smooth and defect free coating.

东莞市致诚科技有限公司

地址:广东省东莞市万江区大汾流涌尾工业区

热线:13713375955(邓工)

QQ: 1296589278

邮箱:1296589278@qq.com /  dgzhicheng@gmail.com

备案号:粤ICP备20043090号

关注公众号

关注公众号

邓工微信

邓工微信(扫一扫添加)